Dirt Rally Crack Only 17 BEST 📢
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10/03/2017 17:26:52Â . 1080p – HD. The single-player campaign is brutally difficult. It is a true test of skill and patience.
10/03/2017 17:26:52Â . 1080p – HD. The single-player campaign is brutally difficult. It is a true test of skill and patience.
10/03/2017 17:26:52Â . 1080p – HD. The single-player campaign is brutally difficult. It is a true test of skill and patience.
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(1) Field of the Invention
The invention relates to the fabrication of integrated circuit devices, and more particularly, to a method of filling vias with conductive material.
(2) Description of the Prior Art
The semiconductor integrated circuit industry has experienced rapid growth in recent years. Technological advances in fabrication processes and materials have produced increasingly smaller and more complex circuits. As the dimensions of the circuits are reduced, improvements of the process including the use of higher resolution lithography techniques are necessary. One technique which improves the resolution of a lithography process is deep ultra violet (DUV) lithography using 193 nm laser wavelength. A problem with 193 nm lithography is that it is a difficult process to fill vias and trenches with metals. The present invention provides a method of reliably filling vias and trenches with metals using 193 nm lithography.
A further problem in semiconductor fabrication is that the simultaneous filling of both vias and trenches requires a two step process. A current process has been to fill only the vias then stop the filling process and remove the photoresist while the trenches remain filled with metal. A second process is then performed to fill the trenches and the remaining open vias are filled with metal. The problem with the two step process is that the second filling process needs to be completed before the next photoresist is applied. A patent which describes a two step process is U.S. Pat. No. 5,841,184. The “”184 patent shows a first photoresist layer applied to the surface of a wafer with vias and trenches etched into the wafer. A metal such as aluminum is then deposited over the wafer and into the etched vias and trenches. The top photoresist layer is then removed leaving the vias and trenches metal filled. A second photoresist layer is then applied over the metal surface and etched to expose the top surface of the wafer. The remaining photoresist is then removed leaving the wafer with metal filled vias and trenches. The “”184 patent does not describe the application of a first photoresist layer, then etched, filling both vias and trenches with